Opto Squad

Vishay's OPTO blog site for the latest in all things OPTO ~ articles, videos, and products

Mounting of Through-Hole LEDs

 

Through-hole LED cases usually consist of epoxy casting compounds with duroplastic properties. It is in the nature of things that optical semiconductor devices require transparent materials with the best possible optical features. Unlike standard IC mold compounds, which use reinforcing fillers like class fibers to achieve better mechanical stability, these optical materials must not be filled. In addition, due to the very small component dimensions, the wall thickness of the casted resin body is also small. All this results in some special aspects regarding mechanical stability during the soldering process to be considered for the processing of leaded LEDs.

Click here to download the full application note.

 

Leave a Reply

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out /  Change )

Google+ photo

You are commenting using your Google+ account. Log Out /  Change )

Twitter picture

You are commenting using your Twitter account. Log Out /  Change )

Facebook photo

You are commenting using your Facebook account. Log Out /  Change )

w

Connecting to %s

Information

This entry was posted on March 2, 2018 by in Application Note, LED.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Enter your email address to follow this blog and receive notifications of new posts by email.

%d bloggers like this: